![]() |
![]() |
||||
|
|
|
|
|
|
|
|
Bruce Rafey Associates is seeing more jobs all the time. Let
us help you deal with these potential opportunities. Client companies
are seeking our assistance as they find other candidate sources to be
ineffective. We have been negotiating the best deals for our candidates
for almost 40 years. We can get you what you truly deserve!! Finding
a job is not for amateurs!
Let us represent you when dealing with experienced corporate recruiters and managers. Professional athletes and entertainers have agents - you should too! All fees are paid by the employers. Click on the Company History tab for more information. CURRENT OPENINGS Process Sustaining Engineer, Optoelectronics Package & Test Department The individual selected for
this position will be part of a team responsible for all aspects of
die separation (mechanical/laser saw, break, and stretch/transfer)
in high volume manufacturing. This engineer will be responsible for
developing, maintaining, and improving various modules and processes
within the area. It is expected that this individual has the
education, desire, and ability to become a technical leader in the
organization. ********************************************* Applications Engineering Manager This position will include
management and development of a team of FAEs supporting all LED
components world-wide along with several support centers. This
individual is responsible for pre- and post-sales technical support
for both existing and new customers & applications for LED
components. They will have a strong understanding of and experience
with LED-based systems design including optical, thermal and
electrical design elements to assist customers in their application
specific LED designs. Manage and develop a team of local and remote
field application engineers supporting regional sales objectives.
Provide pre-sales technical support for direct sales & distributors
through customer presentations and product demonstrations. Assist
customer engineers to successfully design LED components into their
products. Review & discuss customer's requirements & suggest
integrated solutions. Monitor & support customer design efforts;
provide remote and on-site customer support. Perform system design
reviews, lab experiments, retrofitting and prototypes designs.
Coordinate after sale customer support activities including FA
analysis on products returned from the customer. Provide marketing
and product managers with consolidated customer requirements to
define new products and product enhancements. Support new product
introduction with product characterization, demo design, new product
concept prototyping and application design and the development of
datasheets and other customer collateral. Develop reference designs,
design guides and application notes. Develop and present at
technical seminars, tradeshows and distributor & sales training. ********************************************* Principal Design Engineer--RF/Microwave Subsystems Work in a highly motivated
team environment to design and develop advanced miniature microwave
and millimeter wave subsystems and components. Applications include
missile front ends, radar receivers and communication transceivers.
Must have the ability, experience, and desire to lead
multi-disciplined project teams through development programs. Be
responsible for leading project to technical compliance within
schedule and budget. Be able to generate technical proposals and
provide cost input for both recurring and non-recurring engineering.
Perform subsystem level design and analysis of up/down converters
and/or synthesized sources. A Principal Design Engineer will develop
a variety of microwave and millimeter wave circuits, including
amplifiers, filters, frequency multipliers, high power limiters,
oscillators, switches, mixers, etc., as required to support
subsystem activities. Design and develop multi-function microwave
integrated circuits (MICs). Location: California Bay Area ********************************************* Manufacturing Engineer - Metallization Individual must be highly
motivated with a strong desire to work on the manufacturing floor in
a dynamic work environment. Min 1 - 3 years Process Engineering
experience with hi-vac processing and preferred in metal deposition
in a high volume semiconductor production line. Strong
troubleshooting skills, hands on experience with 8D, FMEA, SQS
improvement process, 6S principles, and TPM methods. Hands on
Engineer. Knowledgeable in semiconductor materials and electrical
characteristics, front and back-end processes. In depth, hands on
experience with vacuum pump knowledge. Hands on experience with
back-end processing. Knowledge of Hi-Vac Principles: vacuum
characterization and deposition process optimization. Strong
technical and manufacturing specification writing skills. Skilled in
Statistical Process Control and Design of Experiment. Strong data
analysis and Technical presentation skills. Proficient in current
documentation software and techniques: Microsoft Office application,
JMP and MS project. Able to work closely with manufacturing
operators and maintenance personnel in team environment and provide
training. Location: California ********************************************* Product Engineering Manager Selected candidate will manage
a group of 3 engineers that is responsible for product engineering.
This position reports to the VP of Operations. The product
engineering group?s responsibilities are as follows: Existing
products ? all customer facing documents are accurate and in place
including test specs. Yields and reliability are well controlled and
yield improvement plans are in being executed on. Change control is
managed correctly with marketing and customers. New products ?
manage the new product introduction cycle which span getting desired
product characteristics from customers/marketing, defining the
product, working with engineering to sample and start manufacturing
of the product, ensure all required documentation is in place. This
team will take the project through all new product introduction
phase gates. Location:
Midwest ********************************************* Photovoltaic (PV) Engineer High-caliber individual with several years experience in PV cell development & manufacturing. The critical needs would be: 5+ years experience in PV cell development, integration and process optimization for cell performance and low-cost manufacturing. Extensive experience in electrical characterization of PV Cells, diagnosing/troubleshooting and implementing robust solutions for reliable, high-efficiency solar cell performance. Experienced with solar cell layout, laser scribing, encapsulation, reliability. Experienced in process engineering/characterization (one or more process modules, such as TCO's, a-Si, etc.) Location: Massachusetts ********************************************* New Product Development Manager Work in a lab environment managing the customer process, utilizing semiconductor type equipment in a cleanroom. Formulate, schedule and plan develiopment projects using three core processes: high resolution photo, patterning and electroforming. The focus in on R&D, not manufacturing process engineer. Effectively work with a team of engineers and technicians. Assist in troubleshooting manufacturing processes. Experience in photo, thin film, plating or sputtering. Supervise three employees. MS / BS. Location:
Massachusetts ********************************************* Senior Product Marketing Manager Perform market research and
gather data to identify market opportunities for compnay initial
product launch and develop marketing plans for the future products.
Ideal candidate will also define product specifications to meet
target market applications and comply with industry standards.
Require monitoring competitive activity and market trends in market
for memory devices. Required to define product performance
specifications which will comply with industry standards. Prepare
product data sheets, create marketing literature and assist with
public relations activities. Salary: 120K ********************************************* Device / Process Integration Engineer MS / PhD preferred, 3 years experience. Device Physics, Process Integration for CMOS, LDMOS, Power Management Device Applications and/or experience with BiCMOS, TCAD, Cadence and Virtuoso a plus. Position requires very strong analytical and people skills. Competence in emerging technology areas important. Location: Southern California ********************************************* Senior Process Engineer - Photolithography Responsible for sustaining and developing
manufacturing capability for the photo area. Primarily focused on
coat, develop and stepper processes by: establishing operating
equipment specifications, improving manufacturing techniques and
production yields, Introducting new process equipment to improve
production efficiencies, determining proper materials and
environmental controls for automotive quality manufacturing. Location: Massachusetts ********************************************* Equipment Technician Maintain and operate laboratory systems. Experience with related laboratory materials processing including thermal processes, vacuum deposition, chemical processing - R2R and/or epitaxy desired mechanical & vacuum system design execution. Independent work ethic, identify and resolve problems, communicate with engineering and scientific staff. Process development support role. Experience in similar processes and/or equipment maintenance. Location: Massachusetts ********************************************* Process Integration Engineer Contribute to the development and transfer to manufacturing of key new fabrication processes while working with the Company's contract foundry's engineering and operations staff as well as vendors of new equipment and materials. The primary responsibility will be the process development for a Phase Change Memory integrating the key technologies (processes and materials) of the company product. This individual will have the responsibility for identifying and implementing critical enabling technologies necessary for the successful development and transfer to manufacturing of a phase change memory device. Interaction with Semi equipment manufacturers and suppliers of proprietary thin film materials will also be required. The successful candidate will have the ability to identify and mitigate high risk areas of development, identify root causes and then develop and implement solutions. BS, MS, or Ph.D. in electrical engineering, materials science, physics, chemical engineering, chemistry, or related physical or engineering science. 5+ years experience in key module process development in semiconductor fabrication environment. Demonstrated experience in thin film deposition of GST materials is highly desired. Knowledge of design of experiments (DOE), statistical process control (SPC) and statistical software a plus. Should have experience with AFM, SEM, and other analytical characterization tools. Location: Boston Area ********************************************* Senior Analog Designer Responsible for analog circuits including DACs and ADCs, high speed or precision amplifiers, or power converters. Examples of RF circuits include mixers, high frequency amplifiers, PAs, LNAs, TIAs, clock recovery circuits or frequency synthesizers. Location: Massachusetts ********************************************* Product Engineer Responsible for transitioning the prototype
design of company's proprietary low cost diode memory devices into
volume production. Will perform test and evaluation of die and
packaged parts to verify product integrity and coordinate transfer
of data into product specifications. Will design test fixtures for
bench level or ATE as necessary. Additional Functions: generation of
production documentation associated with new products, data anslysis,
certification of test hardware and software for production, maintain
all product documentation with manufacturing, responsible for cost
reduction through yield and manufacturing improvements. Location: Massachusetts ********************************************* Memory Logic Design Engineer Responsible for managing the design of a family of controller chips which will interface to proprietary low cost diode memory array and achieve compatibility with industry standard removable memory cards and other system interfaces. The ideal candidate for this position will have an advanced understanding of the following technical areas: Knowledge and experience in the logic design of Flash memory, including charge pumps. Knowledge of industry standard solid state removable media characteristics and specifications such as SD, MMC and other card formats. Error correction techniques and design. Creating memory array architectures and specific implementation methods to allow memory array device designs to work efficiently with standard memory controller implementations. Design, debug, and characterization of memory systems necessary to validate and qualify memory device functionality with potential for transfer to production. BS or MS, in electrical engineering CIS, or related fields. 8 to 10 years experience in memory chip design, characterization, and qualification. Location: Boston Preferred (Possibly California) ********************************************* Marketing Manager Manage and lead marketing and applications
engineering organization in fast growing product line. Define and
manage marketing strategies and develop strategic relationships with
key customers in target markets. Lead product definition activities.
Identify and assess new market opportunities. Work and sales and
application engineers to drive and secure customer design-ins and
design-wins. Provide training materials for sales/distribution
personnel and execute sales and FAE training. Support strategic
planning activities, including annual business planning process.
Develop and maintain CRM systems to identify new opportunities and
trends. Collaborate with other marketing groups to provide product
promotion at key customer accounts and in key market segments. Location: Massachusetts ********************************************* Section Head Manage a small group of engineers in specific disciplines (Photo, Metals/Diffusion/Implant and Grind/Polish/Etch). Specific requirements include; At least 10 years semiconductor or MEMS experience in a manufacturing environment. Minimum of a BS in engineering or physics discipline. MS preferred but not required. Manage small group of engineers by driving continuous improvement initiatives, prioritizing projects, helping to manage timelines, driving data driven mentality and helping to introduce the utilization of new technique to improve processing. Strong analytical and problem solving skills. Strong organizational and multi-tasking skills. Ability to drive projects (or direct others to drive projects) from beginning (idea generation) to end (full implementation). Able to work around any potential roadblocks that arrive. Focuses on bringing forth proposed solutions to problems to management (not just problem statements). Capable of organizing and running an effective meeting. Location: Massachusetts
SALARY:
80 - 110K
********************************************* Photolithography Equipment Engineer - Steppers Company develops a MEMS based fuel cell to
provide portable power for cellular telephones, notebook computers and
other small form factor electronic devices. Location: Massachusetts ********************************************* Senior Semiconductor Device Engineer Support memory product design through improvements in device performance, dielectric reliability, and metallization electrical parameters. As a senior device engineer you will: Develop, implement, and characterize electrical and process test structures. Develop device simulation models to predict device behavior and correlate simulations to experimental data. Interact closely with circuit design teams to understand device parametric requirements and with process development teams on process issues and next generation device technology. Perform and/or direct electrical and reliability characterizations. MS/PhD in electrical engineering or physics; 3+ years of industry experience in semiconductor IC device physics, reliability, device modeling, characterization, and analysis. Hands on proficiency with electrical measurement and device simulation tools (e.g. Medici, Dessis, Sentaurus, etc.). Location: Massachusetts ********************************************* Test Engineer Develop production test hardware and software for Mixed Signal IC's used in satellite, cable and terrestrial broadcasts. Support design, system and product engineer and new product characterization. Requires: BSEE with 5 years experience in the field of test engineer. Ability to understand Digital and Analog circuits. Skills in C/C++ for UNIX systems. General knowledge of PC applications. General knowledge of test equipment such as multimeter, oscilloscope, function generator, logic analyzer, etc. ATE experience on Teradyne Catalyst. Experience with Mentor DFT tools. Experience with ORCAD. Location: Open ********************************************* Semiconductor Senior Test Engineer - Analog Mixed Signal Be responsible for implementation of test solutions for analog and mixed signal ASIC devices involving digital, analog, memory, and RF cores. Create test specifications and implement test solutions including DIB/Probe cards/fixture design. Coordinate test efforts between design and manufacturing teams, ASIC suppliers design and test teams, and other test engineers. Provide project technical leadership, mentoring, and development of test engineers within the group. Occasional travel to California, Boston, and other Supplier sites(5%) Requires a BSEE or equivalent, MSEE desired. 7+ years of semiconductor industry, semiconductor device characterization, and test experience. Excellent verbal and written English communication skills required. Teradyne Image software and A500 series, Catalyst or Tiger ATE experience. Location: Boston, MA / Dallas, TX /
Silicon Valley ********************************************* Analog/Digital IC Layout Designer 8+ years experience Layout/Mask Design for bipolar and CMOS analog ICs as well as digital CMOS ICs. Must be proficient with the Cadence Virtuoso suite of tools. Must have a good understanding of fundamental circuit design and theory. Must have strong schematic to layout translation skills. Must have proven abilities in using CAD tools for various IC design tasks including AP&R (VirtuosoXL and/or Silicon Ensemble) as well as layout verification (DRC, LVS, ERC). Must have solid understanding or experience in schematic capture tools.. Must understand A/D and D/A converter designs. AS degree required; BS preferred. Location: Open ********************************************* Applications Engineer Responsible for providing technical support to Field Applications Engineers and Business Unit Directors, including the development of application notes and reference designs. You will also work with customers and third parties to specify and deliver solutions. Provide demo and application development/support and develop market requirement lists, product specifications and technical training plans. Successful candidate will possess a BS degree in a related engineering discipline and a minimum of 5 years of directly related experience. Successful candidate will also possess strong interpersonal and communications skills. Knowledge of analog product is essential. Location: Many Nationwide ********************************************* RF Packaging Engineer Responsible for developing, managing and sustaining subcontracted assembly for packaged RF power products while achieving high yields at the lowest possible cost. Will work with the semiconductor fabrication, device design and applications engineering functions to support overall product development roadmap. Develop packaging concepts; Evaluate, select and manage contract manufacturers that provide packaging services for the company. Work with packaging suppliers and internal groups to reduce cycle time and drive down component costs by modifying the designs; Formalize assembly, packaging and test specifications for in house applications and procurement purposes. Perform simulation, modeling and analysis used in assembling a GaN device in plastic or ceramic packaging. BS Degree in Engineering, Physics or related technical field. Minimum of 5 years of experience in semiconductor packaging. Location: Many Nationwide ********************************************* |
|||||
| Headquarters: 140 Union Street Suite 407 Lynn MA 01901 Tel: 781-581-3373 Toll Free: 800-447-2339 Fax: 781-599-6849 email: rafey@tiac.net |
|
||||
|
[ Home ] [ Company History ] [ Client Company Services ] [ Client Applicant Services ] [ General Openings ] [ Email Form ] |
|||||