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CURRENT OPENINGS



Process Sustaining Engineer, Optoelectronics Package & Test Department

The individual selected for this position will be part of a team responsible for all aspects of die separation (mechanical/laser saw, break, and stretch/transfer) in high volume manufacturing. This engineer will be responsible for developing, maintaining, and improving various modules and processes within the area. It is expected that this individual has the education, desire, and ability to become a technical leader in the organization.

Shift: 1st + One Weekend Day (Sun-Thurs OR Mon-Sat)

Responsibilities: 24x7 process and equipment ownership; Sustain all aspects of die separation processes in high volume, wafer manufacturing; Process improvement and development through carefully designed experimentation and implementation of process control and monitoring techniques; Concieve, drive, and implement yield improvement and cost reduction projects; Interact with engineers, technicians, and scientists to develop, sustain, and improve die separation processes; Insure complete process documentation and QS9000 compliance (FMEAs, Gage RnR, and operation procedures).

BS degree in Mechanical Engineering, Electrical Engineering, Materials Science, or other relevant technical discipline; 3 years engineering experience or an advanced degree; Strong mechanical or electro-mechanical systems experience.

Location: Mid Atlantic
Salary:      80K+

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Applications Engineering Manager

This position will include management and development of a team of FAEs supporting all LED components world-wide along with several support centers. This individual is responsible for pre- and post-sales technical support for both existing and new customers & applications for LED components. They will have a strong understanding of and experience with LED-based systems design including optical, thermal and electrical design elements to assist customers in their application specific LED designs. Manage and develop a team of local and remote field application engineers supporting regional sales objectives. Provide pre-sales technical support for direct sales & distributors through customer presentations and product demonstrations. Assist customer engineers to successfully design LED components into their products. Review & discuss customer's requirements & suggest integrated solutions. Monitor & support customer design efforts; provide remote and on-site customer support. Perform system design reviews, lab experiments, retrofitting and prototypes designs. Coordinate after sale customer support activities including FA analysis on products returned from the customer. Provide marketing and product managers with consolidated customer requirements to define new products and product enhancements. Support new product introduction with product characterization, demo design, new product concept prototyping and application design and the development of datasheets and other customer collateral. Develop reference designs, design guides and application notes. Develop and present at technical seminars, tradeshows and distributor & sales training.

BS degree in Electrical Engineering or Materials Science & Engineering. 5 years of applications engineering management experience - including remote management. 5 years of FAE experience designing LED based systems and/or general lighting design experience.

Location: Mid Atlantic
Salary:    100 - 140K

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Principal Design Engineer--RF/Microwave Subsystems

Work in a highly motivated team environment to design and develop advanced miniature microwave and millimeter wave subsystems and components. Applications include missile front ends, radar receivers and communication transceivers. Must have the ability, experience, and desire to lead multi-disciplined project teams through development programs. Be responsible for leading project to technical compliance within schedule and budget. Be able to generate technical proposals and provide cost input for both recurring and non-recurring engineering. Perform subsystem level design and analysis of up/down converters and/or synthesized sources. A Principal Design Engineer will develop a variety of microwave and millimeter wave circuits, including amplifiers, filters, frequency multipliers, high power limiters, oscillators, switches, mixers, etc., as required to support subsystem activities. Design and develop multi-function microwave integrated circuits (MICs).
BS engineering degree, or technical equivalent, with 8+ years of related engineering experience, or MS engineering degree with 5+ years of related engineering experience is required. US Citizenship and the ability to obtain DOD security clearance is required.

Location: California Bay Area

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Manufacturing Engineer - Metallization

Individual must be highly motivated with a strong desire to work on the manufacturing floor in a dynamic work environment. Min 1 - 3 years Process Engineering experience with hi-vac processing and preferred in metal deposition in a high volume semiconductor production line. Strong troubleshooting skills, hands on experience with 8D, FMEA, SQS improvement process, 6S principles, and TPM methods. Hands on Engineer. Knowledgeable in semiconductor materials and electrical characteristics, front and back-end processes. In depth, hands on experience with vacuum pump knowledge. Hands on experience with back-end processing. Knowledge of Hi-Vac Principles: vacuum characterization and deposition process optimization. Strong technical and manufacturing specification writing skills. Skilled in Statistical Process Control and Design of Experiment. Strong data analysis and Technical presentation skills. Proficient in current documentation software and techniques: Microsoft Office application, JMP and MS project. Able to work closely with manufacturing operators and maintenance personnel in team environment and provide training.
BS: CHE, ME, Chemistry, Physics or EE preferred.

Location: California

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Product Engineering Manager

Selected candidate will manage a group of 3 engineers that is responsible for product engineering. This position reports to the VP of Operations. The product engineering group?s responsibilities are as follows: Existing products ? all customer facing documents are accurate and in place including test specs. Yields and reliability are well controlled and yield improvement plans are in being executed on. Change control is managed correctly with marketing and customers. New products ? manage the new product introduction cycle which span getting desired product characteristics from customers/marketing, defining the product, working with engineering to sample and start manufacturing of the product, ensure all required documentation is in place. This team will take the project through all new product introduction phase gates.
Qualifications: B.S. Electrical Engineering or equivalent; 7+ years experience in the semiconductor industry as a device or product engineer with proven track record in yield improvement and new product introduction; Knowledge of semiconductor manufacturing ? wafer fab and packaging; Knowledge of device and package reliability drivers; Direct experience in the photonics industry is a plus but not required; Previous position as a section manager in the semiconductor industry is a plus; Basic understanding of photonics and physics/technology of laser diodes; Ability to interpret electrical parametric and analytical (SEM, EDX, etc) data; Able to use Project Management tools and work cross-functionally to implement programs with minimal supervision.

Location: Midwest
Salary:     100 - 110K

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Photovoltaic (PV) Engineer

High-caliber individual with several years experience in PV cell development & manufacturing. The critical needs would be: 5+ years experience in PV cell development, integration and process optimization for cell performance and low-cost manufacturing. Extensive experience in electrical characterization of PV Cells, diagnosing/troubleshooting and implementing robust solutions for reliable, high-efficiency solar cell performance. Experienced with solar cell layout, laser scribing, encapsulation, reliability. Experienced in process engineering/characterization (one or more process modules, such as TCO's, a-Si, etc.)

Location: Massachusetts

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New Product Development Manager

Work in a lab environment managing the customer process, utilizing semiconductor type equipment in a cleanroom. Formulate, schedule and plan develiopment projects using three core processes: high resolution photo, patterning and electroforming. The focus in on R&D, not manufacturing process engineer. Effectively work with a team of engineers and technicians. Assist in troubleshooting manufacturing processes. Experience in photo, thin film, plating or sputtering. Supervise three employees. MS / BS.

Location: Massachusetts
Salary: 95 - 120K

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Senior Product Marketing Manager

Perform market research and gather data to identify market opportunities for compnay initial product launch and develop marketing plans for the future products. Ideal candidate will also define product specifications to meet target market applications and comply with industry standards. Require monitoring competitive activity and market trends in market for memory devices. Required to define product performance specifications which will comply with industry standards. Prepare product data sheets, create marketing literature and assist with public relations activities.
BS/BA degree in electrical engineering. 5 - 10 years experience in Marketing role for MEMORY products, ideally NAND Flash Memory. Adept at MS Excel, Word and Power Point.
Location: California

Salary: 120K

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Device / Process Integration Engineer

MS / PhD preferred, 3 years experience. Device Physics, Process Integration for CMOS, LDMOS, Power Management Device Applications and/or experience with BiCMOS, TCAD, Cadence and Virtuoso a plus. Position requires very strong analytical and people skills. Competence in emerging technology areas important.

Location: Southern California

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Senior Process Engineer - Photolithography

Responsible for sustaining and developing manufacturing capability for the photo area. Primarily focused on coat, develop and stepper processes by: establishing operating equipment specifications, improving manufacturing techniques and production yields, Introducting new process equipment to improve production efficiencies, determining proper materials and environmental controls for automotive quality manufacturing.
BS in Engineering, plus minimum of 8 years of related expereince in photo with special knowledge of coat, develop, metrology, particle measurement and stepper. Experience with SVG tracks and Ultratech steppers desirable.

Location: Massachusetts

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Equipment Technician

Maintain and operate laboratory systems. Experience with related laboratory materials processing including thermal processes, vacuum deposition, chemical processing - R2R and/or epitaxy desired mechanical & vacuum system design execution. Independent work ethic, identify and resolve problems, communicate with engineering and scientific staff. Process development support role. Experience in similar processes and/or equipment maintenance.

Location: Massachusetts
Salary:     $25 - 30 / Hour

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Process Integration Engineer

Contribute to the development and transfer to manufacturing of key new fabrication processes while working with the Company's contract foundry's engineering and operations staff as well as vendors of new equipment and materials. The primary responsibility will be the process development for a Phase Change Memory integrating the key technologies (processes and materials) of the company product. This individual will have the responsibility for identifying and implementing critical enabling technologies necessary for the successful development and transfer to manufacturing of a phase change memory device. Interaction with Semi equipment manufacturers and suppliers of proprietary thin film materials will also be required. The successful candidate will have the ability to identify and mitigate high risk areas of development, identify root causes and then develop and implement solutions. BS, MS, or Ph.D. in electrical engineering, materials science, physics, chemical engineering, chemistry, or related physical or engineering science. 5+ years experience in key module process development in semiconductor fabrication environment. Demonstrated experience in thin film deposition of GST materials is highly desired. Knowledge of design of experiments (DOE), statistical process control (SPC) and statistical software a plus. Should have experience with AFM, SEM, and other analytical characterization tools.

Location: Boston Area
Salary:     100 - 120K

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Senior Analog Designer

Responsible for analog circuits including DACs and ADCs, high speed or precision amplifiers, or power converters. Examples of RF circuits include mixers, high frequency amplifiers, PAs, LNAs, TIAs, clock recovery circuits or frequency synthesizers.

Location: Massachusetts

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Product Engineer

Responsible for transitioning the prototype design of company's proprietary low cost diode memory devices into volume production. Will perform test and evaluation of die and packaged parts to verify product integrity and coordinate transfer of data into product specifications. Will design test fixtures for bench level or ATE as necessary. Additional Functions: generation of production documentation associated with new products, data anslysis, certification of test hardware and software for production, maintain all product documentation with manufacturing, responsible for cost reduction through yield and manufacturing improvements.
BSEE, MEEE (or equivalent) with 5+ years experience in memory chip characterization. Prior product engineering experience in Flash Memory.

Location: Massachusetts

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Memory Logic Design Engineer

Responsible for managing the design of a family of controller chips which will interface to proprietary low cost diode memory array and achieve compatibility with industry standard removable memory cards and other system interfaces. The ideal candidate for this position will have an advanced understanding of the following technical areas: Knowledge and experience in the logic design of Flash memory, including charge pumps. Knowledge of industry standard solid state removable media characteristics and specifications such as SD, MMC and other card formats. Error correction techniques and design. Creating memory array architectures and specific implementation methods to allow memory array device designs to work efficiently with standard memory controller implementations. Design, debug, and characterization of memory systems necessary to validate and qualify memory device functionality with potential for transfer to production. BS or MS, in electrical engineering CIS, or related fields. 8 to 10 years experience in memory chip design, characterization, and qualification.

Location: Boston Preferred (Possibly California)

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Marketing Manager

Manage and lead marketing and applications engineering organization in fast growing product line. Define and manage marketing strategies and develop strategic relationships with key customers in target markets. Lead product definition activities. Identify and assess new market opportunities. Work and sales and application engineers to drive and secure customer design-ins and design-wins. Provide training materials for sales/distribution personnel and execute sales and FAE training. Support strategic planning activities, including annual business planning process. Develop and maintain CRM systems to identify new opportunities and trends. Collaborate with other marketing groups to provide product promotion at key customer accounts and in key market segments.
Minimum BSEE or equivalent. 10 years marketing experience or related field. 5 years experience working with customers.

Location: Massachusetts

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Section Head

Manage a small group of engineers in specific disciplines (Photo, Metals/Diffusion/Implant and Grind/Polish/Etch). Specific requirements include;  At least 10 years semiconductor or MEMS experience in a manufacturing environment.  Minimum of a BS in engineering or physics discipline. MS preferred but not required.  Manage small group of engineers by driving continuous improvement initiatives, prioritizing projects, helping to manage timelines, driving data driven mentality and helping to introduce the utilization of new technique to improve processing.  Strong analytical and problem solving skills.  Strong organizational and multi-tasking skills.  Ability to drive projects (or direct others to drive projects) from beginning (idea generation) to end (full implementation). Able to work around any potential roadblocks that arrive.  Focuses on bringing forth proposed solutions to problems to management (not just problem statements).  Capable of organizing and running an effective meeting.

Location:  Massachusetts

SALARY:  80 - 110K

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Photolithography Equipment Engineer - Steppers

Company develops a MEMS based fuel cell to provide portable power for cellular telephones, notebook computers and other small form factor electronic devices.
Equipment Engineers are responsible for troubleshooting, repairing, and maintaining the company's MEMS processing equipment. Troubleshoot, repair, and maintain photolithography equipment such as UT Steppers, EVG Aligners, EVG coater/developer and other Semiconductor/MEMS process equipment down to a component level. Capabilities must include electronic and mechanical troubleshooting. Develop preventive maintenance procedures and spare parts programs for equipment including tracking equipment up-time, analyzing data and developing up-time improvement programs. Modify equipment to make the equipment better suited to the company's requirements. Interface with equipment and parts suppliers to obtain spare parts and technical information as required to keep the company's photolithography equipment running. Technical degree or equivalent experience. A minimum of 5 years of experience in semiconductor and or MEMS process equipment maintenance specifically related to photolithography and Ultratech stepper equipment. Personal computer skills including Microsoft Word, Excel and PowerPoint. Proficiency in technical report writing.

Location: Massachusetts
Salary:     80K

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Senior Semiconductor Device Engineer

Support memory product design through improvements in device performance, dielectric reliability, and metallization electrical parameters. As a senior device engineer you will: Develop, implement, and characterize electrical and process test structures. Develop device simulation models to predict device behavior and correlate simulations to experimental data. Interact closely with circuit design teams to understand device parametric requirements and with process development teams on process issues and next generation device technology. Perform and/or direct electrical and reliability characterizations. MS/PhD in electrical engineering or physics; 3+ years of industry experience in semiconductor IC device physics, reliability, device modeling, characterization, and analysis. Hands on proficiency with electrical measurement and device simulation tools (e.g. Medici, Dessis, Sentaurus, etc.).

Location: Massachusetts

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Test Engineer

Develop production test hardware and software for Mixed Signal IC's used in satellite, cable and terrestrial broadcasts. Support design, system and product engineer and new product characterization. Requires: BSEE with 5 years experience in the field of test engineer. Ability to understand Digital and Analog circuits. Skills in C/C++ for UNIX systems. General knowledge of PC applications. General knowledge of test equipment such as multimeter, oscilloscope, function generator, logic analyzer, etc. ATE experience on Teradyne Catalyst. Experience with Mentor DFT tools. Experience with ORCAD.

Location:  Open
Salary:      75 - 80K

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Semiconductor Senior Test Engineer - Analog Mixed Signal

Be responsible for implementation of test solutions for analog and mixed signal ASIC devices involving digital, analog, memory, and RF cores. Create test specifications and implement test solutions including DIB/Probe cards/fixture design. Coordinate test efforts between design and manufacturing teams, ASIC suppliers design and test teams, and other test engineers. Provide project technical leadership, mentoring, and development of test engineers within the group. Occasional travel to California, Boston, and other Supplier sites(5%) Requires a BSEE or equivalent, MSEE desired. 7+ years of semiconductor industry, semiconductor device characterization, and test experience. Excellent verbal and written English communication skills required. Teradyne Image software and A500 series, Catalyst or Tiger ATE experience.

Location:  Boston, MA / Dallas, TX / Silicon Valley
Salary:      70 - 95K

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Analog/Digital IC Layout Designer

8+ years experience Layout/Mask Design for bipolar and CMOS analog ICs as well as digital CMOS ICs. Must be proficient with the Cadence Virtuoso suite of tools. Must have a good understanding of fundamental circuit design and theory. Must have strong schematic to layout translation skills. Must have proven abilities in using CAD tools for various IC design tasks including AP&R (VirtuosoXL and/or Silicon Ensemble) as well as layout verification (DRC, LVS, ERC). Must have solid understanding or experience in schematic capture tools.. Must understand A/D and D/A converter designs. AS degree required; BS preferred.

Location:  Open
Salary:      60 - 75K

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Applications Engineer

Responsible for providing technical support to Field Applications Engineers and Business Unit Directors, including the development of application notes and reference designs.  You will also work with customers and third parties to specify and deliver solutions.  Provide demo and application development/support and develop market requirement lists, product specifications and technical training plans.  Successful candidate will possess a BS degree in a related engineering discipline and a minimum of 5 years of directly related experience.  Successful candidate will also possess strong interpersonal and communications skills.  Knowledge of analog product is essential.

Location:  Many Nationwide

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RF Packaging Engineer

Responsible for developing, managing and sustaining subcontracted assembly for packaged RF power products while achieving high yields at the lowest possible cost. Will work with the semiconductor fabrication, device design and applications engineering functions to support overall product development roadmap. Develop packaging concepts; Evaluate, select and manage contract manufacturers that provide packaging services for the company. Work with packaging suppliers and internal groups to reduce cycle time and drive down component costs by modifying the designs; Formalize assembly, packaging and test specifications for in house applications and procurement purposes. Perform simulation, modeling and analysis used in assembling a GaN device in plastic or ceramic packaging. BS Degree in Engineering, Physics or related technical field. Minimum of 5 years of experience in semiconductor packaging.

Location:  Many Nationwide

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140 Union Street
Suite 407
Lynn MA 01901
Tel: 781-581-3373
Toll Free: 800-447-2339
Fax: 781-599-6849
email: rafey@tiac.net



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