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CURRENT OPENINGS




Principal Failure Analysis Engineer

Performs electrical analysis and/or physical analysis of defective products from external customers and in-house manufacturing, testing or evaluations groups. Works with appropriate design, process and manufacturing groups to identify defect root cause and determine corrective action. Communicates progress and results directly to customers and other groups/departments. When appropriate, will collaborate with internal/external laboratories in materials analysis. Ensures that analytical techniques and capabilities meet industry standards (e.g. JEDEC) and customer requirements while driving toward “world class" practices and standards. Distributes reports that track failure modes, mechanisms and root causes of defects as product is assembled and tested onsite, as well as reporting on those products that have failed in the field. Meet failure analysis cycle time requirements
Requires expert knowledge in many aspects of the physics of failure of IC’s, PCB’s, and/or electronic components. Strong knowledge of integrated circuits, components, PCBs and manufacturing/assembly processes Demonstrated experience using state-of-the-art failure analysis methods and techniques Experience using a wide variety of diagnostic equipment such as SEM, CSAM, EDS, Bench Test equipment, Xray, Plasma Etcher, etc. Ability to lead a team and coordinate resources to meet customer responsiveness metrics. Ability to effectively communicate with a wide variety of internal and external customers and/or suppliers. Experience working with the following applications: MS Office, MS Project and MS Visio in generating reports, capturing data, and presenting data and information in a logical/user friendly format. Knowledge and understanding of business processes and how decisions impact customer satisfaction, product quality and on-time delivery.
Qualifications: Minimum of 10+ years directly related experience. Bachelor's degree in related field, e.g. BSEE, Physics or Materials Science. Familiarity with Semiconductor manufacturing and assembly including PCB based products.

Location: New England

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Senior Product Quality Engineer

Responsible for creating, documenting, developing, and implementing quality processes and procedures in a fabless semiconductor environment. Individual will be hands on and capable of performing physical measurements of components as well as some level of incoming inspection. Must have strong knowledge of ISO 9001:2008 and will be responsible for ISO support efforts. Work with consultant during internal audits. Issue and drive CAPA activity including SCAR and internal audit findings. Communicate with suppliers to bring corrective action exercises to closure. Monitor and track PCN activity as part of supplier management initiative. Assist in performing accelerated life testing and burn-in evaluations of packaged IC’s as necessary. Will assist Product Quality Manager with the implementation and maintenance of Omnify PLM system. Maintain quality documentation/history. Work closely with failure analysis and reliability functions to support their activities and initiatives. Document results in a timely and logical manner.
BSEE or Equivalent. Minimum of 6 years experience in a Product Quality Engineering role. Must possess a well-rounded background in Semiconductor/Electronics manufacturing, with particular focus on product life cycle, trouble-shooting and inspection of manufacturing processes. Experience in the application of semiconductor industry quality and reliability systems and practices. Experience working with PLM systems such as Omnify, Agile or Matrix One. Ability to drive projects to completion while working as part of a cross functional team. Experience with drawing programs, such as Visio.

Location: New England

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Reliability Engineer

Provide solutions to physical problems in support of the introduction of new products and the production of existing products. Lead cross-functional problem-solving teams to resolve customer quality, product and application issues. Manage product, process, quality and reliability improvement projects. Develop qualification plans and reports for new integrated circuit product introduction. Work with R&D Engineers to ensure the reliability of new integrated circuit wafer fabrication techniques and processes, new silicon devices and new packaging platforms. Work with Wafer Fabrication Engineers to validate device reliability due to process changes, new equipment and new wafer fab start-ups. Work with Assembly Engineers and Subcontractor Management to validate assembly materials changes, process changes, new equipment start-ups and new assembly site start-ups. Work with Failure Analysis Engineers to determine the failure mechanisms for reliability failures.
B.S. (M.S. preferred) in Engineering or Science related discipline is required. At least three (3) to five (5) years experience in Semiconductor Manufacturing, Assembly, Product Engineering, Quality or Reliability Engineering.

Location: Southern California

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Failure Analysis Engineer

Familiar with use of failure analysis equipment and techniques i.e. SEM, EDX, Photoemission, FIB, Thermal Imaging, Auger Analysis, CSAM, Plasma Etching, Curve Tracer and other advance techniques used in FA field. Able to understand device layout and circuit diagrams for the devices submitted for FA. Able to use chemicals and follow safe practices in performing destructive physical analysis of devices. Write comprehensive reports on failure analysis performed on failed devices. Interface with customers and offer advice/guidance on technical matters relating to failure analysis of their product. Review existing failure analysis processes, produces and equipment and effect improvements. Monitor and schedule workload of failure analysis and summarize FA data for inclusions in the quarterly reliability report. Develop advance FA Techniques. Pioneer FA procedures for new technologies.
B.S. in Electrical Engineering or Science related discipline and 2+ years experience in failure analysis field on semiconductor devices. Ability to understand electrical characteristics of transistors/FETS, IGBT, Diodes and ICs. Able to use curve tracer and other test equipment for electrical verification/testing of devices. Package assembly and Fabrication process knowledge is required.

Location: Southern California

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Sr. Packaging Engineer

Lead the overall package design effort for power module and hybrid products packages. Work with team members and /or vendors to perform mechanical analysis, thermal and thermal mechanical analysis, material and process compatibility analysis for power module and hybrid packages to define the mechanical portion of the specifications and make technical proposals accordingly. Develop new products and apply theories and knowledge to achieve completion. Identify opportunities to solve customer needs by assisting customers in their designs; Make recommendations to resolve technical issues and to define their requirements based on company capabilities. Specify equipment, materials, and suppliers for completion and implementation of technical tasks. Work closely with suppliers to develop and qualify the packages.
Bachelors in Mechanical Engineering, Material Science, or equivalent and 10 plus years (seven years for Ph. D) hands experience; Master’s, or Ph. D preferred. Experienced in structural and thermal analysis including finite element analysis. Must have experience with ANSYS and SOLIDWORKS and/or other CAD/Simulation software. Must have strong background and knowledge in materials science. Working knowledge of MIL-PRF-38534.

Location: Massachusetts
Salary:     100 – 120K

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Product Support Specialist

Provide timely technical support to the Field by phone & electronic media. Travel to customer sites when required for closure of system escalations. Document workarounds & product support bulletins for problem resolutions. Work closely with the Engineering, Final Test & process groups for resolution of difficult system down situations.
Minimum AS Electromechanical Technology or equivalent military experience. 2-5 Years Ion Implant hands on system troubleshooting. Load Port/Buffer/Factory Automation experience. Other Semiconductor Equipment experience (Applied Materials / Axcellis / Novellus) maintenance & troubleshooting experience.
Must be able to work off shift hours & weekend rotational beeper coverage.

Location: Massachusetts

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Senior Product Marketing Manager

Key responsibility is to coordinate PLAD Engineering development activities with R&D, Hardware, Software, Marketing, Value Engineering, Engineering Product Managers, and Product Marketing to insure that all product requirements, specifications, release, quality, manufacturability, and margin goals are met. Helping define company product engineering development and CIP programs on the Plasma Doping (PLAD) product line. Assist in the sales process with customer presentations. Contribute to formulating and executing Strategic Plan with emphasis on the current product line. This includes: Maintain the applications/forecast database; Keep up to date competitive analyses for major applications. Contribute to the new product development for advanced plasma doping applications by helping define and writing the market requirements document. Help identify and define new applications for Plasma Products. 5-7 years related experience in product engineering or product management positions with major manufactures’ of capital (process) equipment for semiconductor industry preferably on a plasma product. BS (MS preferred) in electrical engineering, mechanical engineering, materials science, chemical engineering, or related technical discipline. Requires hands-on experience with advance process development, qualification, sustaining, and troubleshooting of plasma processes and tools in the advanced CMOS technology. Must be capable of formulating business strategy, preparing business plan, and presenting to internal customers, and marketing partners.

Location: Massachusetts

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Principal Mechanical Engineer Plasma Chamber Group

Will be working on current and next generation plasma doping tools. As a key contributor to this product, you will be responsible for the design, test and development of chamber components over the product life cycle. Emphasis will be on mechanical design for plasma chambers and components internal to plasma chambers, material selection, component wear and particle control for high volume industrial application semiconductor tools with validation through component and system testing. Experience with electrostatic chucks in a plasma environment is desirable. You will need to be able to perform thermal, stress/strain analysis, vacuum analysis is a plus. Contribute to the development of semi conductor capital equipment. Technical direction of engineering projects in a focused, schedule driven effort to design chamber and mechanical subsystems. Lead subsystem design effort including specifications, design, analysis, and release to production. The successful candidate will bring a Systems Engineering approach to this program. Bachelor’s degree (MS preferred) in Mechanical or Manufacturing Engineering. Minimum of 7-10 years of related product development work experience. Experience with a capital equipment Semiconductor company is strongly preferred. 3D modeling experience is required, Pro E experience is a plus. Have design experience in most of the following areas: simple controls electronics, geometric dimensioning and tolerancing, tolerancing analysis of assemblies, knowledge of manufacturing techniques, design for cost, schedule and reliability.

Location: Massachusetts

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Device / Process Integration Engineer

Individual will be responsible for process / device electrical performance, optimization and product probe yield improvement. Process electrical performance includes end of line electrical (PCM) disposition, Cp/Cpk improvement and process margin optimization. Involve up front process transfer from R&D into manufacturing with robust process modules. Interface and support customer issues. In depth device physic application with working knowledge of process interaction to support customer interface with product and test related issues.
Provide technical expertise to facilitate problem solving of yield issues. Extensive use of data-mining analysis skills to analyze and solve device yield issues. Continually monitor probe yields and identify areas for improvement opportunity. Work closely with, and advise process engineering and production on yield-related issues. Work closely with other yield analysis organizations that provide services such as parametric testing (e-test), physical failure analysis, and electrical failure analysis. Model and forecast device yields and yield improvement goals for various process technologies for communication to external and internal customers and work with them on yield-related issues. Analyze end-of-line and in-line electrical parameters in order to disposition wafers Design experiments to improve processes in order to better control end-of-line electrical parameters. Develop and continuously improve statistical process control tools. Support, through data analysis, the transfer of existing processes to partners. Design, document and test process control monitor modules
Support customer requests for electrical data and special measurements.
BS, MS or PhD in Electrical Engineering, with Device Physics in RF related area is a strong plus. 5-7 years experience with strong understanding of yield analysis skills, as well as device application and process and product interactions.

Location: Southern California

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MEMS Process Development Engineer

The qualified candidate will be responsible for research, development and improvement of existing and newly developed devices & process technologies, including MEMS fabrication processes, for manufacture in a 200mm semiconductor wafer foundry. The individual will aid and lead design implementations and new integration by bringing customers to volume production. Part of the integration of MEMS with existing RF CMOS, HV CMOS and BiCMOS manufacturing for applications in volume consumer, wireless, and defense related products. Responsible for Process technology development and implementation in VLSI manufacturing, foundry environment. Device level characterization and understanding, examples: HBT (NPN, PNP), FET (CMOS), image sensor, MEMS (resonator, switch). Participate in and coordinate experiments toward technology development and yield enhancement. Technologies to be developed involve BiPolar, MS/RF CMOS, image sensor, MEMS and other value added devices or process modules. MEMS processing on volume production equipment. MEMS integration: including module development, test, design, yield, and interaction with fab experts in unit module manufacturing. Interaction with MEMS mechanical and product design experts (e.g. CAD, simulation and modeling). Process capability and specification, and semiconductor manufacturing metrics (Cpk, FMEA, foundry process transfer, etc.). Prototype process qualification (HTOL, burn-in, g-force, shock, etc.). Work with process engineering team, test team, customers to define goals and manufacturing solutions.
Semiconductor fab skills in process development, integration, and reliability. Silicon CMOS 200mm wafer manufacturing toolset knowledge. R&D project experience for prototyping MEMS devices of direct relevance. MEMS technology process and integration experience preferred - e.g. DRIE, release, seal, deposition, patterning, stress measurements and characterization, metrology. Experience with MEMS CAD (Coventor) a plus.

Location: Southern California

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Senior I/O Designer

The IO design team is seeking a senior mixed signal circuit designer.
Key Responsibilities: Defines architecture and full custom circuit design of mixed-signal IP blocks (examples: DDR, GDDR, HT, Ethernet, PCI Express, SATA, etc.). Participate in key standards definition groups. Drive key forward-looking circuit technology initiatives. Work with other functional groups (controller, package, signal integrity, etc.) to drive an overall solution. MS or PhD degree in electrical engineering specializing in full-custom circuit design, with hands on industry experience of 8+ years. In depth hands on design experience in high-speed IO transceiver and PHY, including PCIe, DDR/GDDR, HDMI/DVI, and high-voltage tolerant IO. Good communication, mentorship, and leadership skills. Knowledge in high-speed SerDes architecture, clock data recovery systems, PLL and DLL. working knowledge of semiconductor devices, process technologies, and signal integrity. Experience in lab debug

Location: Massachusetts

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Principal Applications Engineer – Power Devices

Provide technical leadership to increase company business in power device market. Work with Power Device manufacturers to develop value of Implant and differentiation of company products. Work with a team of marketing, technical, and engineering professionals to develop advanced implant solutions for the power device industry. Lead process development projects with Power Device manufacturers, translate to implant requirements. Develop technical/ marketing collateral to promote implanter application. Plan and hold regular technical review meeting with customers in consultation with the manager and other drivers of the Power Device program. Design and conduct independent technical experiments, analyses or tests pertaining to the development of new methods, processes, and standards, process specifications, and resolution to complex technical problems.
Requires 5-7 years experience in semiconductor processing as a process engineer or process integration engineers with at least 3 years of experience in power devices. A strong understanding of power device applications, roadmap, market, and requirements is needed. Requires advanced degree (M.S./Ph.D) in Material Sciences / Electrical Engineering / Chemical Engineering/ Physics or related subjects.

Location: Massachusetts

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Principal Mechanical Engineer – Plasma

Responsible for working on current and next generation plasma doping tools. As a key contributor to this product, you will be responsible for the design and development of the chamber over the product cycle. Emphasis on material selection, component wear and particle control in aggressive chemistry environments. Material selection will involve thermal, vacuum, particle, metals, cleaning, and plasma erosion performance evaluation. An understanding of the above criteria is required, along with experience in validation of these criteria through component and system testing.
Experience in a plasma environment and with materials knowledge with 7- 10 years’ work experience and a Master’s degree highly desired. Project management skills are required as job responsibilities will include managing and maintaining joint development programs with vendors and customers. Experience with bringing designs from concept thru production preferred. Mechanical engineering design experience within plasma chambers is required. Semiconductor and vacuum experience would be a plus.
Applicant will be considered the “Plasma Chamber Design Expert”.

Location: Massachusetts
Salary:    130-150K

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Senior Manufacturing / Foundry Engineer

Company is a provider of wireless sensor and control network technologies.
Responsible for working with engineers and vendors on production processing and product planning. This is an individual contributor role with responsibility for developing, maintaining and improving the high integrity of our manufacturing processes and leading manufacturing cost reduction initiatives. Applicant should have foundry experience in Test, Assembly and some Fab. Work directly with vendors on product related issues. Lead manufacturing cost and efficiency improvement programs. Monitor and maintain process yield, cycle time and quality performance. Support the selection of new suppliers, monitor supplier quality improvement and participate supplier audits. Perform internal audits and manage the corrective / preventive action process for those audits. Work closely with the Manufacturing Quality Engineer to ensure that processes and products are compliant with customer and internal quality requirements.
5+ years experience in manufacturing operations and process disciplines of which at least 2 years experience in a high technology manufacturing environment. Understanding of the IC development and production process. Understanding of Software development process. Experience in supplier, process and product qualifications required. Working knowledge of ISA 9000:2000. Working knowledge of JEDEC standards and other related standards from the semiconductor industry.
Bachelor’s degree or equivalent experience in engineering EE, ME or Industrial Engineering degree.

Location: Massachusetts

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Foundry Engineering Manager

Ensures high quality, low-cost goods & services; develops and approves foundry supplier base; negotiates pricing & quality acceptance terms as part of vendor supply agreements; ensures vendor's delivery, quality, & price performance; develops and maintain appropriate foundry performance measurement systems. Position will collaborate with Process, Product, and Design Engineering organizations to identify and diagnose process defect yield and manufacturability issues and to implement effective solutions. Drives continuous improvements in quality assurance initiatives. Supports engineering development and qualification of new foundry process and product activities. Drives process change qualification and approval efforts as required. Develops device reliability measurement and monitoring tools. Develop and manages models for key yield improvement mechanisms. Correlates test yields to foundry PCM data. Uses statistical process control, and other related monitors for managing quality / acceptance levels. Support new product transfer into manufacturing through the use of design for manufacturing, DFM, and design for test, DFT, guidelines.
Bachelor's degree in Chemical and/or Materials Engineering, or in another related science, and has a minimum of 5-10 years of demonstrated engineering management experience in III-IV compound & semiconductor wafer fabrication industry. Additional and/or advanced business administration education is highly desirable. Experience in the microwave industry is preferred.

Location: Massachusetts

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Test Engineer

Develop production test hardware and software for Mixed Signal IC's used in satellite, cable and terrestrial broadcasts. Support design, system and product engineer and new product characterization. Requires: BSEE with 5 years experience in the field of test engineer. Ability to understand Digital and Analog circuits. Skills in C/C++ for UNIX systems. General knowledge of PC applications. General knowledge of test equipment such as multimeter, oscilloscope, function generator, logic analyzer, etc. ATE experience on Teradyne Catalyst. Experience with Mentor DFT tools. Experience with ORCAD.

Location:  Open
Salary:      75 - 80K

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Analog/Digital IC Layout Designer

8+ years experience Layout/Mask Design for bipolar and CMOS analog ICs as well as digital CMOS ICs. Must be proficient with the Cadence Virtuoso suite of tools. Must have a good understanding of fundamental circuit design and theory. Must have strong schematic to layout translation skills. Must have proven abilities in using CAD tools for various IC design tasks including AP&R (VirtuosoXL and/or Silicon Ensemble) as well as layout verification (DRC, LVS, ERC). Must have solid understanding or experience in schematic capture tools.. Must understand A/D and D/A converter designs. AS degree required; BS preferred.

Location:  Open
Salary:      60 - 75K

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Headquarters:
Swampscott, MA 01907
Tel: 781-581-3373
email: rafey@rafey.com



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